printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.
Annual installed capacity :500.000m2 Material :FR1 FR2 FR3 Cem 1 Aluminum (others upon request) Material thickness :0,8 mm 2,4 mm (others upon request) Final copper thickness
:35 Micron
70 Micron 100 Micron Structure :130 micron( 5 mil) Smallest hole diameter :Punched 0,60 mm ( + 0,1 ; - 0) Drilled 0,30 mm Solder Mask :UV solder mask Additional prints :Component print Carbon print for contacts and bridges (1 mm 2 / 12-15 Ω ) & dieleicct printing Peelable ink Surfaces :OSP (Organic Solderability Preservative) ⇒lead free HASL (Hot Air Solder Leveling) ⇒lead free Immersion Thin Plating Outline processing :Punching Scoring (V-Cut) CNC Routing Test :Electrical test (100%) Test voltage ⇒40-250 VDC Unit of resistance ⇒1-10 k Ω Test area ⇒500 x 800 mm Minimum test points ⇒1,27 mm( 1/20”) Visual inspection ( 100%) Hole counting Annual installed capacity :20.000m2 Laminates used :FR 4 Production process :Panel plating through hole Patern Plating Material thickness :0,8 mm, 2,4 mm Others upon request Final copper thickness :35 micron 70 micron 100 micron Structure :130 micron( 5 mil) Smallest hole diameter :Drilled - 0,30 mm Punched - (slots, non PTH) Solder Mask :Liquid photoimageable solder mask Curtain coating Additional prints :Two-pack silk screen ink Carbon print for contacts and bridges (1 mm 2 / 12-15Ω) Peelable ink Surfaces :OSP (Organic Solderability Preservative) ⇒lead free HASL (Hot Air Solder Leveling) ⇒lead free Immersion Thin Plating Gold Finish (on edge connector fingers only) Outline processing Punching Scoring (V-Cut) CNC Routing Test :Electrical test(100%) Test voltage ⇒40-250 VDC Unit of resistance ⇒1-10 k Ω Test area ⇒500 x 800 mm Minimum test points ⇒0,63 mm ( 1/40”) Visual inspection
