LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.

Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0402, 0603, and 0805) as well as custom sizes.

Features:

• High thermal conductivity
• Low capacitance
• High insulation resistance

Applications:

• Power Converters
• Power amplifiers
• Filter and synthesizers
• Pin and laser diodes

The LMU20P1 is a miniaturized step-up Power Supply in Package (PSiP) offering small size and high efficiency.

The PSiP includes an integrated circuit and an inductor in a compact 2 mm x 2 mm x 0.75 mm package.

The package is optimized for automated assembly by standard surface-mount pick-and-place equipment. The converter has a light-load efficiency enhancement function to achieve high efficiency across a wide load range, and features a range of protection circuits that include soft start, over-temperature protection, short-circuit protection and cycle-by-cycle current limit.

The LMU20P1 offers exceptionally low near-field radiation levels and proprietary start-up circuit to minimize input inrush current.

FEATURES:

• 0.5 V – 1.6 V input voltage range
• 1.4 V – 1.8 V output voltage range
• 100 mA continuous load operation
• Best in class efficiency
• PFM light load mode
• 2 mm x 2 mm package
• 0.75 mm maximum profile
• Integrated inductor
• 5 MHz switching frequency (PWM)
• Internal loop compensation
• Soft-Start, OTP, SCP, cycle by cycle current limit
• RoHS compliant

APPLICATIONS:

• Hearing aids
• IoT sensors
• Wearables
• Single and double cell PV powered applications
  
  

The LMU20P1 is a miniaturized step-up Power Supply in Package (PSiP) offering small size and high efficiency.

The PSiP includes an integrated circuit and an inductor in a compact 2 mm x 2 mm x 0.75 mm package.

The package is optimized for automated assembly by standard surface-mount pick-and-place equipment. The converter has a light-load efficiency enhancement function to achieve high efficiency across a wide load range, and features a range of protection circuits that include soft start, over-temperature protection, short-circuit protection and cycle-by-cycle current limit.

The LMU20P1 offers exceptionally low near-field radiation levels and proprietary start-up circuit to minimize input inrush current.

FEATURES:

• 0.5 V – 1.6 V input voltage range
• 1.4 V – 1.8 V output voltage range
• 100 mA continuous load operation
• Best in class efficiency
• PFM light load mode
• 2 mm x 2 mm package
• 0.75 mm maximum profile
• Integrated inductor
• 5 MHz switching frequency (PWM)
• Internal loop compensation
• Soft-Start, OTP, SCP, cycle by cycle current limit
• RoHS compliant

APPLICATIONS:

• Hearing aids
• IoT sensors
• Wearables
• Single and double cell PV powered applications

Characterized using FLIR A70 under ambient
conditions. The evaluation board is 35 mm x
35 mm 2 layer board with a copper thickness of
35 μm and total board thickness of 0.8 mm. The
device is stressed such that the surface temperature
stabilizes at approx. 150 ◦C with no thermal
aid, creating the reference case when populating
the LTG devices.